JPH025028B2 - - Google Patents
Info
- Publication number
- JPH025028B2 JPH025028B2 JP58130675A JP13067583A JPH025028B2 JP H025028 B2 JPH025028 B2 JP H025028B2 JP 58130675 A JP58130675 A JP 58130675A JP 13067583 A JP13067583 A JP 13067583A JP H025028 B2 JPH025028 B2 JP H025028B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- power supply
- wiring layer
- hole
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58130675A JPS6022394A (ja) | 1983-07-18 | 1983-07-18 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58130675A JPS6022394A (ja) | 1983-07-18 | 1983-07-18 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6022394A JPS6022394A (ja) | 1985-02-04 |
JPH025028B2 true JPH025028B2 (en]) | 1990-01-31 |
Family
ID=15039924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58130675A Granted JPS6022394A (ja) | 1983-07-18 | 1983-07-18 | 配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6022394A (en]) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62190337A (ja) * | 1986-02-13 | 1987-08-20 | Fujita Corp | クリ−ンル−ムにおける換気、空調吹出装置 |
JPH0247892A (ja) * | 1988-08-10 | 1990-02-16 | Hitachi Ltd | セラミック多層配線基板 |
JPH0297052A (ja) * | 1988-10-03 | 1990-04-09 | Toto Ltd | セラミック多層配線基板 |
JP7237474B2 (ja) * | 2018-06-18 | 2023-03-13 | 京セラ株式会社 | セラミック配線基板およびプローブ基板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5824459U (ja) * | 1981-08-07 | 1983-02-16 | 宮田 浩哉 | エアクリ−ナ |
-
1983
- 1983-07-18 JP JP58130675A patent/JPS6022394A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6022394A (ja) | 1985-02-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5132613A (en) | Low inductance side mount decoupling test structure | |
JPH0220848Y2 (en]) | ||
EP0176245B1 (en) | Multilayer wiring substrate | |
US4744007A (en) | High density LSI package for logic circuits | |
US5854534A (en) | Controlled impedence interposer substrate | |
US6495912B1 (en) | Structure of ceramic package with integrated passive devices | |
EP0130207A1 (en) | SEMICONDUCTOR CHIP PACKAGE. | |
JPH06103704B2 (ja) | 集積回路パッケージの製造方法、集積回路アセンブリおよびバイアの形成方法 | |
JPH0477469B2 (en]) | ||
US4546406A (en) | Electronic circuit interconnection system | |
EP0471938A1 (en) | High circuit density thermal carrier | |
JPH09508760A (ja) | 薄膜再分配域を備えた多層モジュール | |
JPS6022396A (ja) | 回路基板 | |
US6888218B2 (en) | Embedded capacitor multi-chip modules | |
JPH025028B2 (en]) | ||
JPH04290258A (ja) | マルチチップモジュール | |
US7105926B2 (en) | Routing scheme for differential pairs in flip chip substrates | |
US5527999A (en) | Multilayer conductor for printed circuits | |
JP4128440B2 (ja) | 部品内蔵モジュール | |
JPH06112355A (ja) | セラミックパッケージ | |
JPS6135703B2 (en]) | ||
JP4099072B2 (ja) | 部品内蔵モジュール | |
JPH0513560B2 (en]) | ||
JPS6219072B2 (en]) | ||
JPS6159534B2 (en]) |